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INTERNATIONAL PATENT: ORION MACHINERY CO., LTD., オリオン機械株式会社, ORION MACHINERY (SHANGHAI) CO., LTD., 好利旺機械(上海)有限公司 FILES APPLICATION FOR "MULTISTAGE TYPE BIAXIAL ROTARY PUMP AND MULTISTAGE TYPE CLAW PUMP"

GENEVA, Dec. 1 -- ORION MACHINERY CO., LTD. (246, Oaza Kotaka, Suzaka-shi Nagano3828502), オリオン機械株式会社 (長野県&#38... Read More


INTERNATIONAL PATENT: NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY, 国立大学法人金沢大学 FILES APPLICATION FOR "MEASURING DEVICE FOR AUDITORY ORGAN"

GENEVA, Dec. 1 -- NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY (Nu 7, Kakuma-machi, Kanazawa-shi, Ishikawa9201192), 国立大学法人金沢大&#233... Read More


INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "DOHERTY AMPLIFICATION CIRCUIT"

GENEVA, Dec. 1 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京都... Read More


INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックIPマネジメント株式会社 FILES APPLICATION FOR "BATTERY"

GENEVA, Dec. 1 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックIPマネ&#1... Read More


INTERNATIONAL PATENT: JFE STEEL CORPORATION, JFEスチール株式会社 FILES APPLICATION FOR "HIGH-STRENGTH GALVANIZED STEEL SHEET AND METHODS FOR PRODUCING HIGH-STRENGTH GALVANIZED STEEL SHEET AND HOT-ROLLED STEEL SHEET AND COLD-ROLLED STEEL SHEET FOR PRODUCING HIGH-STRENGTH GALVANIZED STEEL SHEET"

GENEVA, Dec. 1 -- JFE STEEL CORPORATION (2-3, Uchisaiwai-cho 2-chome, Chiyoda-ku, Tokyo1000011), JFEスチール株式会社 (東&#201... Read More


INTERNATIONAL PATENT: NIPPON STEEL CORPORATION, 日本製鉄株式会社 FILES APPLICATION FOR "SINTERED ORE PRODUCTION METHOD"

GENEVA, Dec. 1 -- NIPPON STEEL CORPORATION (6-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008071), 日本製鉄株式会社 (東京都千&#2019... Read More


INTERNATIONAL PATENT: PROSPIRA CORPORATION, 株式会社プロスパイラ FILES APPLICATION FOR "SUSPENSION ARM AND BUSH"

GENEVA, Dec. 1 -- PROSPIRA CORPORATION (580, Horikawa-cho, Saiwai-ku, Kawasaki city, Kanagawa2120013), 株式会社プロスパイラ (神&#22856... Read More


INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, THERMOSETTING ADHESIVE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE"

GENEVA, Dec. 1 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都&#282... Read More


INTERNATIONAL PATENT: HITACHI, LTD., 株式会社日立製作所, ASTEMO, LTD., ASTEMO株式会社 FILES APPLICATION FOR "POWER CONVERSION DEVICE"

GENEVA, Dec. 1 -- HITACHI, LTD. (6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008280), 株式会社日立製作所 (東京都千代&... Read More


INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "MOVEMENT CONTROL DEVICE, MOBILE BODY DEVICE, MOVEMENT CONTROL SYSTEM AND MOVEMENT CONTROL METHOD"

GENEVA, Dec. 1 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都&#21315... Read More